Characteristics of garnet micropowder for silicon wafer and optical glass grinding
Garnet micropowder for silicon wafer and optical glass grinding has the following characteristics:
1. Physical properties
High hardness and toughness
Garnet has moderate hardness (Mohs 7.5-8.0), is wear-resistant and low brittle, can reduce the breakage rate during grinding and extend service life. Density reaches 4.2g/cm³, sharp particles and sharp edges, which improves grinding efficiency.
Uniform particle size distribution
Garnet micropowder particle size specifications cover W63 to W5, which can be customized according to needs to meet high-precision grinding requirements.
2. Chemical stability
Garnet has stable chemical properties, does not contain harmful components such as free silicon and heavy metals, complies with international standards such as ISO 11126, and avoids contamination of the processing surface.
3. Process advantages
Low breakage rate and recyclability
Garnet has a low breakage rate and can be recycled 5-10 times, reducing the cost of use.
Low dust and environmental protection
Garnet micropowder undergoes multiple water washing processes during production, and the dust content is extremely low; it has a high specific gravity and settles quickly, reducing dust during operation.
4. Application effect
Garnet micropowder is suitable for grinding precision devices such as silicon wafers and optical glass lenses, and can achieve a high-smooth surface without scratches.
It is also used in sandblasting and polishing, grinding wheel/emery cloth production and other fields, and is suitable for a variety of materials (such as metals, plastics, and ceramics).
Note: Garnet micropowder is widely used in semiconductor and optical industries, thanks to its comprehensive performance advantages, such as high grinding efficiency, environmental protection and cost controllability.
